1.59 3.53 0.2032 0.360.05 front view 2 1 3 15.00 0.80 typ 12.80 top view proprietary and confidential - the information contained in this drawing is the sole property of ironwood electronics, inc. any reproduction in part or as a whole without the written permission of ironwood electronics, inc. is prohibited. 1 substrate: 1.59mm 0.18mm [0.0625" 0.007"] fr4/g10 or equivalent high temp material; non-clad 2 pins: material- brass alloy 360 1/2 hard; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). 3 solder balls: see table. part no. suffix solder ball alloy -61 sn63pb37 -61f* sn96.5ag3.0cu0.5 *rohs compliant sheet 1 of 1 date: 12/09/13 material: n/a finish: n/a weight: 0.90 rev. a file: SF-BGA256K-B-61 ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com eng: s. faiz status: released description: giga-snap bga foot, 17x17 array, 0.8mm pitch 15mm sq. scale: 4:1 primary dimension units are millimeters, secondary dimension units are [inches]. tolerances: hole diameters 0.0254mm [0.001"], pitches (from true position) 0.0254mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.127mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. SF-BGA256K-B-61f specification drawn by: d. hauer SF-BGA256K-B-61 specification
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